3D FPGA versus Multiple FPGA System: Enhanced Parallelism in Smaller Area

Nunna, K. C., Mehdipour, F. and Murakami, K.

Handling large amounts of data is being limited by bandwidth constraint between processors components and their memory counterparts. Three-dimensional integration (3D) is providing possible solution to handle such critical applications. Especially for running larger designs when implementing on multi-FPGA system, which can produce huge amount of fine-grain parallelism, for satisfying the speed and reliability needs, 3D FPGA can be considered as a close candidate to chose. In this paper we tried to show the benefits of running larger designs on 3D FPGA compared to running on multi-FPGA systems using benchmark simulation. Results showed that a TSV-based 3D FPGA achieved better performance and area results.

Cite as: Nunna, K. C., Mehdipour, F. and Murakami, K. (2014). 3D FPGA versus Multiple FPGA System: Enhanced Parallelism in Smaller Area. In Proc. Twelfth Australasian Symposium on Parallel and Distributed Computing (AusPDC 2014) Auckland, New Zealand. CRPIT, 152. Javadi, B. and Garg, S. K. Eds., ACS. 37-43

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